SRI supports these MEMS fabrication capabilities:

Design and modeling

• Mask layout and solid model creation using computer-aided design

• Finite element multi-physics modeling

• Process development

• Rapid 3D printing for prototype visualization

Process and packaging

• Thin-film patterning and lithography

• Laser patterning and ablation

• Advanced resist plating technology

• Reactive Ion Etching (RIE) and Deep Reactive Ion Etching (DRIE) etching

• Silicon processing and bulk micromachining

• Thin/thick film deposition

• Microwave enhanced plasma chemical vapor deposition of nanocrystalline diamond films, and intrinsic and nitrogen-doped microcrystalline films  

• Spatially selective chemical vapor deposition

• Substrates: up to 6-inch silicon, glass, ceramics, and polymers

• Device packaging: wafer-to wafer bonding, chip bonding, die packaging, and wire bonding

Analysis and testing

• Scanning electron microscopy with energy dispersive spectroscopy (EDAX)

• Focused ion beam milling

• Optical microscopy

• Interface/film/device characterization

• Surface profilometry

• Ultraviolet, visual, and infrared (UV-Vis-IR) spectrophotometry

• Wafer and chip electrical probing

• Vacuum probing, micro-nano manipulation