MEMS Cleanrooms (Class 10 and Up) | SRI International

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MEMS Cleanrooms (Class 10 and Up)

SRI offers these MEMS fabrication capabilities in support of government and commercial client projects:

Design and modeling

  • Mask layout and solid model creation using computer-aided design
  • Finite element multi-physics modeling
  • Process development
  • Rapid 3D printing for prototype visualization

Process and packaging

  • Thin-film patterning and lithography
  • Laser patterning and ablation
  • Advanced resist plating technology
  • Reactive Ion Etching (RIE) and Deep Reactive Ion Etching (DRIE) etching
  • Silicon processing and bulk micromachining
  • Thin/thick film deposition
  • Microwave enhanced plasma chemical vapor deposition of nanocrystalline diamond films, and intrinsic and nitrogen-doped microcrystalline films  
  • Spatially selective chemical vapor deposition
  • Substrates: up to 6-inch silicon, glass, ceramics, and polymers
  • Device packaging: wafer-to wafer bonding, chip bonding, die packaging, and wire bonding

Analysis and testing

  • Scanning electron microscopy with energy dispersive spectroscopy (EDAX)
  • Focused ion beam milling
  • Optical microscopy
  • Interface/film/device characterization
  • Surface profilometry
  • Ultraviolet, visual, and infrared (UV-Vis-IR) spectrophotometry
  • Wafer and chip electrical probing
  • Vacuum probing, micro-nano manipulation
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