Optical and Mechanical Microsystems

We design, fabricate and test advanced optical and mechanical microsystems for drug discovery, integrated electronics, particle delivery to skin and more.

Microsystems enable us to interact with and manipulate very small objects. We have a diverse group of researchers with physics, biology, and engineering backgrounds working in this area. Together, we enable expert design, fabrication, and testing of advanced optical and mechanical microsystems for numerous applications, building on our experience in developing high-throughput industrial systems for printing and biomedical applications. Specifically, we develop:

  • Micro Assembly Printers for High-Performance Integrated Electronics: using microfabricated electrostatic arrays to arrange and orient particles and chips, which are then transferred onto a final substrate. Example applications include semiconductor chiplet assembly for large-area sensor arrays, fine chiplet custom electronics, metamaterials, and optoelectronic integration. Download our MOSAIC (Micro-Scale Optimized Solar-Cell Arrays with Integrated Concentration System) Information Sheet to learn more.
  • Microjet Particle Delivery to Skin: building microscale channel arrays for use in particle ejectors. We deliver laser-like particle streams to controlled positions and depths. This approach is compatible with large reservoirs of powder payloads, which enables large doses and quick deployment in epidemics. Application examples include vaccine and prophylactic delivery, mass epidemic responses and cosmetics.
  • High Throughput Calorimetry for Drug Discovery: rapidly mixing droplets and measuring small temperature changes to enable label-free enthalpy measurements for pharmaceutical drug discovery is currently a low throughput process. We have developed a microfluidic droplet architecture for even higher throughput and sensitivity. Temperature is measured optically via thermochromic materials in mixed droplets.
  • Stress Engineered Thin-Films for Rematable Flip Chip Interconnects and 3D Inductor Coils: building thin-film metals with controlled stress to make thermally stable 3D structures. The metal traces can be used to make flip-chip interconnects, enabling integrated at-speed testing and rework for multi-chip modules. The process scales to high density (we have shown 6um pitch) and we have passed thermocycle reliability testing. The process also enables high Q inductor coils, which we have integrated into CMOS.

Thin-Film and Novel Electronics Cleanroom Services

Our clients benefit from our expertise in working with semiconductor thin-film materials including amorphous silicon, metal oxides, low temperature poly-silicon and MEMS.  We have fully developed processes to design and fabricate a wide variety of active devices.

Download our Thin-Film Cleanroom information sheet to learn more.

Optoelectronics Cleanroom and Resource Services

We have fully developed processes to design and fabricate a wide variety of active optoelectronic devices. Our facilities support sponsored R&D and product development for clients to prototype novel optical sources and systems that are transferable to manufacturers.

Download our Optoelectronics Cleanroom information sheet to learn more.

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