Printed electronics – the impact on electronic displays and sensor devices


Daniel, J. H.; Arias, A. C.; Ng, T.; Russo, B.; Krusor, B. S. Printed electronics – the impact on electronic displays and sensor devices. International Conference on Flexible and Printed Electronics (ICFPE); 2009 November 11-13; Jeju Island, Korea.


Printing techniques such as inkjet printing are promising manufacturing methods for electronic circuits because they are compatible with roll-to-roll processing on flexible substrates. In this talk, an overview of various areas of flexible electronics will be given with focus on inkjet-printing. Inkjet printing is a digital, non-contact printing method that enables accurate drop placement with efficient materials usage. Much of the interest in flexible printed electronics has focused on displays. We have used inkjet printing to fabricate active-matrix pixel circuits on flexible substrates in an all-additive solution process. These pixel backplanes were able to address electrophoretic display media. Current challenges are the achievement of higher pixel resolution and the integration of printed circuits with conventional silicon-based display driver electronics. In the quest to find new applications for flexible and printed electronics, a novel louver-type display concept will be proposed. Recently, some of the focus in printed electronics has shifted towards inexpensive or large-area sensor applications. We are developing a blast sensor tape to detect the occurrence of events that cause traumatic brain injury (TBI) in military or sports environments. In order to meet the low cost target of the tapes, printing techniques are employed. Printing methods also allow rapid design or sensor layout variations for task specific applications. In one example, our sensor tape is designed so that multiple sensors are positioned at different locations around a helmet. Novel challenges had to be addressed such as low-voltage operation and complementary printed organic electronics. The sensor tape combines integrated sensors, signal conditioning electronics, non-volatile memory and a thin film battery.

Read more from SRI