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  • Research
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  • Novel packaging with rematable spring interconnect chips for MCM

    A novel packaging approach has been demonstrated for circuits connected with flexible microsprings.

    May 29, 2009
  • Silver-clad nitride semiconductor laser diode

    An edge-emitting laser diode structure is described in which the conventional upper cladding layer is replaced with a metal contact selected for its optical as well as electrical properties.

    January 26, 2009
  • Stress-engineered MEMS

    After a little introduction to PARC, I’ll describe how we’ve been using designed stress gradients (GPa/um) to make a variety of micro-devices.

    October 27, 2008
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