Publications
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Poster: A System for Creating Assessment of Higher-Order Reasoning in Specific Undergraduate Domains
Poster presentation at the annual project manager’s meeting of the Institute of Education Sciences, U.S. Department of Education. Washington, D.C.
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Bridging School and Home: Students’ Engagement with Technology-Rich Activities
This poster describes ongoing work that examines students use of a computer-based learning environment designed to bridge school and out-of-school learning contexts by incorporating affordances of both formal and informal…
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Development of Medical Countermeasures for Biodefense: How Far Have We Come in Seven Years?
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Higher-Order and Symbolic Computation: Editorial
Higher-Order and Symbolic Computation is an international journal that presents a broad-spectrum forum for discussion of results and ideas on programming with higher-order and symbolic facilities: first-class functions and continuations,…
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Organizational Drawing Strategy Enhances Visuospatial Memory in Alcoholism: a 3-Year Follow-Up Study
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Heterogeneity of Brain Dysmorphology in Human Alcoholism: Us-France Collaborative Project
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Many-to-many communication for mobile ad hoc networks
We introduce a collaboration-driven approach to the sharing of the available bandwidth in wireless ad hoc networks, which we call many-to-many communication, that allows concurrent multi-packet transmissions (MPTs) and multi-packet…
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Wafer level packaging with soldered stress engineered micro-springs
Micro springs for integrated circuit test and packaging are demonstrated as soldered flip chip interconnects in a direct die to printed circuit board package.
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Flexible printed sensor tape for novel applications
We are developing a blast sensor tape to detect the occurrence of events that cause traumatic brain injury (TBI) in military environments.
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Design patterns for assessing model-based reasoning
This report provides a set of design patterns to help assessment designers, researchers, and teachers create tasks for assessing aspects of model-based reasoning: Model Formation, Model Use, Model Elaboration, Model…
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Novel packaging with rematable spring interconnect chips for MCM
A novel packaging approach has been demonstrated for circuits connected with flexible microsprings.
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Degrees of separation
This talk will describe how we induce precipitation or suspension formation from dissolved materials, promote aggregation of smaller suspensions into larger and more robust agglomerates, and capture for reuse of…